SN74LVC2G17MDCKREP,丝印代码:BZV,封装:SC-70-6,厂家:TI - 芯片丝印反查网

marking code, top mark, smd code, device marking, top marking, device code
型号:SN74LVC2G17MDCKREP
丝印代码:BZV
厂家:TI
封装:SC-70-6
脚针数:5
描述:查看更多(View More)
BOM: