BYG60M,丝印代码:60M,封装:SMA/DO-214AC,厂家:NXP/PHILIPS - 芯片丝印反查网

marking code, top mark, smd code, device marking, top marking, device code
型号:BYG60M
丝印代码:60M
厂家:NXP/PHILIPS
封装:SMA/DO-214AC
脚针数:0
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