SN74LVC2G157YZP,丝印代码:___C3_,封装:BGA-8,厂家:TI - 芯片丝印反查网

marking code, top mark, smd code, device marking, top marking, device code
型号:SN74LVC2G157YZP
丝印代码:___C3_
厂家:TI
封装:BGA-8
脚针数:0
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