SN74LVC1G27YZP,丝印代码:___CU_,封装:WCSP-6,厂家:Ti - 芯片丝印反查网

marking code, top mark, smd code, device marking, top marking, device code
型号:SN74LVC1G27YZP
丝印代码:___CU_
厂家:Ti
封装:WCSP-6
脚针数:0
描述:查看更多(View More)
BOM: