BQ30Z554DBTR-R1,丝印代码:BQ30Z554,封装:30,厂家:TI - 芯片丝印反查网

marking code, top mark, smd code, device marking, top marking, device code
型号:BQ30Z554DBTR-R1
丝印代码:BQ30Z554
厂家:TI
封装:30
脚针数:0
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