BD18GA3MEFJ-ME2,丝印代码:18GA3M,封装:HTSOP-J8 - 芯片丝印反查网

marking code, top mark, smd code, device marking, top marking, device code
型号:BD18GA3MEFJ-ME2
丝印代码:18GA3M
厂家:
封装:HTSOP-J8
脚针数:0
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BOM: