CLVC1G175MDCKREP,丝印代码:BUD_,封装:SC-70-6,厂家: - 芯片丝印反查网

marking code, top mark, smd code, device marking, top marking, device code
型号:CLVC1G175MDCKREP
丝印代码:BUD_
厂家:
封装:SC-70-6
脚针数:6
描述:查看更多(View More)
BOM: