HD74LV2G157AUS,丝印代码:L57,封装:SSOP-8,厂家:Ren - 芯片丝印反查网

marking code, top mark, smd code, device marking, top marking, device code
型号:HD74LV2G157AUS
丝印代码:L57
厂家:Ren
封装:SSOP-8
脚针数:8
描述:查看更多(View More)
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