BD18HC0WEFJ-E2,丝印代码:18HC0W,封装:HTSOP-J8 - 芯片丝印反查网

marking code, top mark, smd code, device marking, top marking, device code
型号:BD18HC0WEFJ-E2
丝印代码:18HC0W
厂家:
封装:HTSOP-J8
脚针数:0
描述:查看更多(View More)
BOM: