BD30HC5MEFJ-ME2,丝印代码:30HC5M,封装:HTSOP-J8 - 芯片丝印反查网

marking code, top mark, smd code, device marking, top marking, device code
型号:BD30HC5MEFJ-ME2
丝印代码:30HC5M
厂家:
封装:HTSOP-J8
脚针数:0
描述:查看更多(View More)
BOM: