REG1117F-3.3,丝印代码:BB1117F4,封装:DDPAK-3,厂家: - 芯片丝印反查网

marking code, top mark, smd code, device marking, top marking, device code
型号:REG1117F-3.3
丝印代码:BB1117F4
厂家:
封装:DDPAK-3
脚针数:3
描述:查看更多(View More)
BOM: