HD74LV1G66ACM,丝印代码:L9,封装:CMPAK-5,厂家:Ren - 芯片丝印反查网

marking code, top mark, smd code, device marking, top marking, device code
型号:HD74LV1G66ACM
丝印代码:L9
厂家:Ren
封装:CMPAK-5
脚针数:0
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