HZM13N B3,丝印代码:133 (1),封装:MPAK-3,厂家:Renesas(Hitachi) - 芯片丝印反查网

marking code, top mark, smd code, device marking, top marking, device code
型号:HZM13N B3
丝印代码:133 (1)
厂家:Renesas(Hitachi)
封装:MPAK-3
脚针数:0
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